Heat Dissipation | Efficient |
---|---|
Material | Ceramic, SiC , Al₂O₃ , SiO₂,Al₄C₃ |
Durability | Long-lasting |
Temperature Resistance | <700℃ |
Application | Transistor, MOSFET, Schottky Diode, IGBT, High-density Switching Power Supply, High-frequency Communication Signal Equipment, High Frequency Welding Machines And Other Electronic Devices |
Weight | Lightweight |
---|---|
Heat Dissipation | Efficient |
Surface Roughness | 0.3-08 Um |
Density | 3.7g/cm^3 |
Insulation Strength | ≥15KV/mm |
Material | Ceramic, SiC , Al₂O₃ , SiO₂,Al₄C₃ |
---|---|
Warpage | ≤2‰ |
Mechanical Strength | ≥3000MPa |
Heat Dissipation | Efficient |
Durability | Long-lasting |
Weight | Lightweight |
---|---|
Size | Various Sizes Available |
Thermal Conductivity | 9~180 MW/m.K |
Surface Roughness | 0.3-08 Um |
Warpage | ≤2‰ |
Thermal Conductivity | 9~180 MW/m.K |
---|---|
Warpage | ≤2‰ |
Durability | Long-lasting |
Temperature Resistance | <700℃ |
Mechanical Strength | ≥3000MPa |