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Lightweight Ceramic Heat Spreader / Light Weights with Ultralow Surface Roughness

Low MOQ
MOQ
Negotiable
Price
Lightweight Ceramic Heat Spreader / Light Weights with Ultralow Surface Roughness
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Features
Specifications
Weight: Lightweight
Heat Dissipation: Efficient
Surface Roughness: 0.3-08 Um
Density: 3.7g/cm^3
Insulation Strength: ≥15KV/mm
Material: Ceramic, SiC , Al₂O₃ , SiO₂,Al₄C₃
Thermal Conductivity: 9~180 MW/m.K
Color: Green,Black,White,Gray
Highlight:

Lightweight Ceramic Heat Spreader

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Ultralow Surface Roughness Ceramic Heat Spreader

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Light Weights Ceramic Heat Spreader

Basic Infomation
Place of Origin: China
Brand Name: Race
Certification: ISO9001 , ISO14001, TS16949
Model Number: Ceramic Heat Sink/Ceramic Micro Porous Heat Sink
Payment & Shipping Terms
Packaging Details: As customer requirements
Delivery Time: 7-15 days
Payment Terms: 30% TT in advance, the balance payment is paid before shipment.
Product Description

Product Description:

The Ceramic Heat Sink's open-porous structure increases air contact area, allowing for effective heat dissipation. Its good thermal conduction and low thermal expansion coefficient ensure efficient heat transfer and prevent damage caused by thermal expansion. With a density of 3.7g/cm^3 and a temperature resistance of <700℃, this heat sink is suitable for a range of applications, from consumer electronics to industrial machinery.

What sets our Ceramic Heat Sink apart is its exceptional mechanical strength of ≥3000MPa. This makes it highly durable and able to withstand the rigors of daily use. Whether you're looking to improve the performance of your laptop or optimize the cooling system in your factory, our Ceramic Heat Sink is the perfect solution.

 

Features:

  • Product Name: Ceramic Heat Sink
  • Warpage: ≤2‰
  • Application: Transistor, MOSFET, Schottky Diode, IGBT, High-density Switching Power Supply, High-frequency Communication Signal Equipment, High Frequency Welding Machines And Other Electronic Devices
  • Surface Roughness: 0.3-08 Um
  • Material: Ceramic, SiC , Al₂O₃ , SiO₂,Al₄C₃
  • Weight: Lightweight
  • Low cost
  • With and without thermally conductive Silicone adhesive tape
  • Open-porous structure increases air contact area
 

Technical Parameters:

Technical Parameter Value
Insulation Strength ≥15KV/mm
Durability Long-lasting
Surface Roughness 0.3-0.8 Um
Heat Dissipation Efficient
Material Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃
Warpage ≤2‰
Temperature Resistance <700℃
Size Various Sizes Available
Application Transistor, MOSFET, Schottky Diode, IGBT, High-density Switching Power Supply, High-frequency Communication Signal Equipment, High Frequency Welding Machines And Other Electronic Devices
Thermal conductivity 9~180 MW/m.K

No Electromagnetic compatibility (EMD) issues, SiC/ AL2O3/ SIO2, EMI reduction

 

Applications:

This product is perfect for various applications such as electronic devices, power supplies, LED lighting, and automotive industry. Its lightweight feature makes it easy to install and use.

The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink from Race is certified with ISO9001, ISO14001, and TS16949 making it a reliable and safe choice for customers. It also has a low MOQ and negotiable pricing, making it accessible to a wide range of consumers.

This ceramic heat spreader comes in four different colors: green, black, white, and gray, and can be packaged according to customer requirements. Delivery time ranges from 7-15 days, and payment terms include 30% TT in advance, with the balance payment paid before shipment.

Overall, the Ceramic Heat Sink/Ceramic Micro Porous Heat Sink from Race is a versatile product that can cater to various scenarios and occasions. Its high reliability, silicon carbide, and ceramic material make it a top choice for businesses and individuals who prioritize quality and efficiency in their products.

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Tel : 139237177061
Fax : 86-139-2371-7061
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