Thermal conductivity 9 to 180 MW per meter Kelvin Ceramic Micro Porous material for heat dissipation applications in industrial processes

Product Description:

The Ceramic Heat Sink is an advanced thermal management solution designed to efficiently dissipate heat from electronic components, ensuring optimal performance and longevity. Engineered with a high-density ceramic material boasting a density of 3.7g/cm ³ , this heat sink offers superior thermal conductivity while maintaining a lightweight profile, making it an ideal choice for various applications where effective heat dissipation is critical.

Available in multiple colors including green, black, white, and gray, the Ceramic Heat Sink not only meets functional requirements but also caters to aesthetic preferences and design needs. The availability of various sizes allows for flexible integration into different electronic devices, accommodating a wide range of form factors and design specifications. Whether you need a compact solution for small ICs or a larger heat sink for more substantial components, this product line provides an ideal fit.

One of the standout features of this Ceramic Heat Sink is its efficient heat dissipation capability. The ceramic material used is inherently thermally conductive, enabling rapid transfer of heat away from sensitive components such as integrated circuits (ICs). This helps to maintain lower operating temperatures, reduce the risk of thermal damage, and enhance the overall reliability and lifespan of electronic devices. The efficiency of heat dissipation is further complemented by the product’s compatibility with thermally conductive adhesive tape with pull tab for direct IC surface mount applications. This tape facilitates easy and secure attachment of the heat sink to the IC surface, ensuring optimal thermal contact and minimizing thermal resistance.

In addition to thermal performance, the Ceramic Heat Sink is designed to withstand challenging environmental conditions. It is not affected by humidity and dust, which are common factors that can degrade the performance and reliability of conventional heat sinks. This resistance to environmental contaminants makes it highly suitable for use in a variety of industrial, automotive, and consumer electronics applications where exposure to moisture and particulate matter is unavoidable.

Another important advantage of this Ceramic Heat Sink is its cost-effectiveness. Despite offering high-performance thermal management, it remains a low-cost solution, making it accessible for both large-scale manufacturing and smaller projects. Its affordability does not compromise quality or performance, allowing designers and engineers to implement efficient cooling solutions without exceeding budget constraints.

The lightweight nature of the Ceramic Heat Sink is a crucial benefit, especially in applications where weight is a critical factor such as portable electronics, drones, and aerospace components. The reduced weight contributes to overall device portability and ease of handling, while still delivering robust heat dissipation performance.

In summary, the Ceramic Heat Sink combines excellent thermal conductivity, environmental resilience, lightweight design, and cost efficiency into a versatile thermal management component. Its availability in various colors and sizes allows for seamless integration into diverse electronic designs. The use of thermally conductive adhesive tape with pull tab for direct IC surface mount enhances installation convenience and thermal performance. Resistant to humidity and dust, and featuring a density of 3.7g/cm ³ , this product is engineered to meet the demanding requirements of modern electronic cooling solutions efficiently and reliably.

Features:

• Product Name: Ceramic Heat Sink
• Surface Roughness: 0.3-0.8 µm
• Available Colors: Green, Black, White, Gray
• Mechanical Strength: ≥3000 MPa
• Insulation Strength: ≥15 KV/mm
• Warpage: ≤2‰
• Material Composition: SiC (Silicon Carbide), AL2O3, SIO2
• No Electromagnetic Interference (EMI) issues
• Excellent thermal management with Silicon Carbide technology

Technical Parameters:

Applications:

The Race Ceramic Heat Sink, also known as the Ceramic Micro Porous Heat Sink, is an advanced thermal management solution originating from China. Designed with high-quality materials such as Ceramic, SiC, Al₂O₃, SiO₂, and Al₄C₃, this product boasts exceptional mechanical strength of ≥3000MPa and an insulation strength of ≥15KV/mm, making it an ideal choice for applications requiring a non electrically conductive heat spreader. Its density of 3.7g/cm³ ensures a perfect balance between lightweight design and durability, providing long-lasting performance in demanding environments.

This ceramic heat spreader is highly suitable for use in electronic devices, power modules, LED lighting systems, and high-frequency communication equipment where efficient heat dissipation is crucial. The product’s superior insulation properties prevent electrical interference, ensuring high reliability and safety in sensitive electronic applications. It is especially beneficial in scenarios where traditional metal heat sinks fall short due to electrical conductivity issues.

The Ceramic Heat Sink from Race meets rigorous international standards, holding certifications such as ISO9001, ISO14001, and TS16949. This guarantees consistent quality and environmental compliance, making it a trusted component in automotive, aerospace, telecommunications, and industrial sectors. With a low minimum order quantity and negotiable pricing, it caters to both small-scale and large-scale production needs. Custom packaging options are available to meet specific customer requirements, ensuring secure and convenient delivery.

Delivery times range from 7 to 15 days, supported by flexible payment terms including a 30% TT advance and balance payment before shipment, facilitating smooth procurement processes. Whether used in high-performance CPUs, power electronics, or precision instruments, the Race Ceramic Micro Porous Heat Sink provides an outstanding combination of thermal conductivity, electrical insulation, and mechanical robustness, making it an indispensable component for modern heat dissipation challenges.