GTP200 8.0 W/mK Thermal Conductive Silicone Pad for IGBT Power Module Cooling

GTP200 8.0 W/mK Thermal Conductive Silicone Pad

GTP200 is a fiberglass reinforced thermal conductive silicone pad engineered for continuous heat transfer between high power semiconductors and heat sinks. With a bulk thermal conductivity of 8.0 W/m·K and a very low contact resistance, the pad moves heat away from IGBT modules, rectifier bridges and motor drivers before junction temperature builds up.

Why GTP200 Delivers Excellent Thermal Conductivity

• 8.0 W/m·K through-plane conductivity, verified batch by batch with a hot disk analyser
• Fiberglass mesh carrier keeps the pad dimensionally stable under 30% compression, so conductivity does not drop after clamping
• Soft Shore 00 25-45 body wets rough machined surfaces and fills micro air gaps that would otherwise block heat flow
• 10 KV/mm dielectric strength allows direct contact with live metal tabs without an extra insulator
• Low compression set after 1000 h at 150 °C, keeping interface resistance stable for the whole service life

Technical Parameters

Typical Applications

• IGBT and SiC power modules in inverters and welding machines
• Rectifier bridges and motor drivers in industrial drives
• Automotive ECU and on-board charger housings
• Telecom rectifier shelves and server power units

Customization and Support

Sheets, strips, die-cut shapes and pre-applied adhesive options are available. Our engineering team can recommend a thickness and compression ratio based on your gap tolerance, clamping force and target thermal resistance, and free samples are ready for evaluation.